The SiPFAB project (System-in-Package Fabrication) at Tampere University is building a state-of-the-art semiconductor integration and packaging pilot line in a joint European effort.
With 40 million euros in funding from the EU and Business Finland, the initiative offers outstanding career opportunities.
“The project is not about traditional university research, but product and process development. The focus is on commercialization, with companies actively involved in development and testing”, Project Director Tuomas Lahtinen explains.
Europe aims to become a global leader in semiconductors, drive new technological innovations, and grow production. The EU Chips Act is driving this vision forward, and one of its most exciting investments is already underway in Tampere.